Formula 5 of the hottest epoxy resin modified epox

2022-08-24
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Epoxy resin, modified epoxy resin adhesive formula (V)

hn-302

formula

component dosage/g component dosage/g

A, E-51 epoxy resin 100 aluminum oxide (300 mesh) 50

nitrile rubber-404 B, diethylenetriamine 12.5

Trimethylphenol phosphate 15 A: b=100:7.4

preparation and curing are weighed in turn, mixed evenly, and weighed at 25 ~ 30 ℃ for 48h, or 80 ~ 30 ℃.Cure at 90 ℃ for 2 ~ 3H

usage this adhesive is used for bonding metal, rubber, plastic, wood, etc. it can be cured at room temperature and is convenient to use. Component B has strong exertion and pungent odor

E-4 adhesive

formula

component dosage/g component dosage/g

A, E-44 epoxy resin 4.7 polyvinyl acetal 12.6

zinc phenolic resin 15.7 B, 2-ethyl-4-methylimidazole 1

solvent (ethyl acetate: absolute ethanol =7:3) 67 a:b=100:1

preparation and curing are weighed proportionally, mixed evenly, bonding pressure 0.05 ~ 0.1MPa, and cured for 1H at 80 ℃.At 130 ℃ for 4H

usage this glue is used for the bonding of aluminum, steel and off-duty steel, and the bonding of grinding wheels. The metal structural adhesive used at 150 ℃ has excellent heat resistance and can withstand 250 ℃ in a short time

afg-80 adhesive

formula

afg-80 amino tetrafunctional epoxy resin 100 647# anhydride 80

liquid nitrile 10 2-ethyl-4-methylimidazole 2

preparation and curing are weighed in proportion in turn, and then mixed evenly. The bonding pressure is 0.05Mpa, and the curing time is 3H under 150

usage this adhesive is used for the bonding of Vicat softening point testing machine with computer control technology and windows Chinese (English) interface metal, glass, porcelain, glass fiber reinforced plastics and other materials

kh-51 epoxy adhesive

formula

component dosage/g component dosage/g

E-51 epoxy resin 100 m-phenylenediamine 14

liquid nitrile rubber-4018 ~ 20 2-ethyl-4-methylimidazole 4

preparation and curing: weigh in turn according to the dosage, and mix evenly. Cure at 120 for 3h

purpose at the same time, it provides customers with extensive technical support to make them use these products more effectively. This adhesive has good comprehensive properties such as bonding performance and medium resistance, and is used for bonding aluminum alloy, steel, copper or glass fiber reinforced materials

kh-225 adhesive

formula

component dosage/g component dosage/g at this time, it should be far away from the source

the finer the ink is, E-51 epoxy resin 100 2-ethyl-4-methylimidazole 10

carboxyl terminated nitrile-21 35

preparation and curing should be weighed according to the dosage in turn and mixed evenly. The curing time is 804 ~ 8h, or 3H at 120 ℃

usage this adhesive is used for bonding metals, FRP, hard plastics, ceramics, glass, jade, etc. It is suitable for bonding parts with complex shapes

MS-3 adhesive

formula

component dosage/g component dosage/g

E-51 epoxy resin 100 phenyldibutylurea 16

liquid nitrile rubber-4020 fumed silica 2

dicyandiamide 10

preparation and curing: first heat the liquid part in the formula, mix evenly, and then add the solid part to mix evenly. Mix well before use. Cure for 8h at 90 ℃. Or 6h at 100 ℃. Or 2H at 130 ℃

usage this adhesive is used for bonding aluminum, steel, copper and other metals, ceramics, glass, bakelite and other non-metallic materials, and can also be used for sealing. Excellent adhesion, low toxicity and low curing temperature. It can also be used at 100 ℃

glue

formula

component dosage/g component dosage/g

E-51 epoxy resin 100 aluminum oxide powder (300 mesh) 50

nitrile-40 4 m-phenylenediamine 15

Trimethylphenol phosphate 15

preparation and curing: weigh and prepare components a and B according to the dosage, and mix them evenly in proportion when using. Bonding pressure 0.03 ~ 0.07MPa; The curing time is 1D at room temperature and 2H at 150 ℃. Suitable for 50g, 6h at 25 ℃

usage this adhesive has high bonding strength and is resistant to water, sea water, fuel oil and transformer oil. It can be used within -55 ~ 150 ℃. It is mainly used for bonding metal, rubber, plastic, glass, ceramics, cement, stone, wood and other materials. It is especially suitable for the bonding of metal and rubber, and the occasion of bonding through rubber vulcanization

250 epoxy adhesive

formula

component dosage/g component dosage/g

bisphenol s epoxy resin 100 liquid nitrile rubber 10

E-51 epoxy resin 100 20 # polyamide 200

D-17 epoxy resin 20 acetone, butanone appropriate amount

preparation and curing weigh and mix evenly according to the dosage, and then add 200 # polyamide to mix evenly. The bonding pressure is 0.05Mpa, and the curing condition is 6h at 50 ℃ or 2 ~ 3H at 100 ℃

usage this adhesive is used for bonding aluminum alloy, copper, iron and non-metallic materials

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